Description

Designed as an all-round thermal paste with the best possible price-performance ratio the EC360® CARBON series is the ideal thermal interface material for gaming PCs and industrial cooling systems. Nano-Carbon compounds blended in a base of nanometer sized metal oxide particles (silver/aluminum/ boron/zinc) enable ultimate stability and a high thermal conductivity of 5.15W/mK. Its good consistency makes it easy to spread and install. It is long-lasting: low bleed, non-flowing and low evaporation mean it will stay in place and not dry out over time. At the same time, it is not electrically conductive, which allows a safe application.

Specs

Types and Configuration

TypeAvailable sizes
Tube1 g, 20 g

Material Composition

TypePercentage
Aluminium Oxide40%
Silicone37%
Magneisum Oxide20%
Graphene3%

Technical Properties

PropertiesUnitValueTest method
Color-greyvisual
Thermal ConductivityW/mk11ASTM D 5470
Thermal Resistance°C-in2/W0.0013ASTM D 5470
Specific Gravityg / cm^33.2ASTM D 792
Evaporation (150°/24h)%0.15FED STD 791
Volume ImpedanceOhm-cm3.0 x10¹³ASTM D 257
ViscositycP15000-
Dielectric Constant1Mhz3.0ASTM D 150
Usable Temperatures°C-30 - 240EN 244

Gallery

Downloads

Datasheets