Description
Designed as an all-round thermal paste with the best possible price-performance ratio the EC360® CARBON series is the ideal thermal interface material for gaming PCs and industrial cooling systems. Nano-Carbon compounds blended in a base of nanometer sized metal oxide particles (silver/aluminum/ boron/zinc) enable ultimate stability and a high thermal conductivity of 5.15W/mK. Its good consistency makes it easy to spread and install. It is long-lasting: low bleed, non-flowing and low evaporation mean it will stay in place and not dry out over time. At the same time, it is not electrically conductive, which allows a safe application.
Specs
Types and Configuration
| Type | Available sizes |
|---|---|
| Tube | 1 g, 20 g |
Material Composition
| Type | Percentage |
|---|---|
| Aluminium Oxide | 40% |
| Silicone | 37% |
| Magneisum Oxide | 20% |
| Graphene | 3% |
Technical Properties
| Properties | Unit | Value | Test method |
|---|---|---|---|
| Color | - | grey | visual |
| Thermal Conductivity | W/mk | 11 | ASTM D 5470 |
| Thermal Resistance | °C-in2/W | 0.0013 | ASTM D 5470 |
| Specific Gravity | g / cm^3 | 3.2 | ASTM D 792 |
| Evaporation (150°/24h) | % | 0.15 | FED STD 791 |
| Volume Impedance | Ohm-cm | 3.0 x10¹³ | ASTM D 257 |
| Viscosity | cP | 15000 | - |
| Dielectric Constant | 1Mhz | 3.0 | ASTM D 150 |
| Usable Temperatures | °C | -30 - 240 | EN 244 |
Gallery
EC360® DIAMOND
Packaging Front
EC360® DIAMOND
Packaging Back
EC360® DIAMOND
1g Tube
EC360® DIAMOND
20g Tube
Downloads
Datasheets
EC360® DIAMOND
Thermal Paste Datasheet (PDF)