Designed as an all-round thermal paste with the best possible price-performance ratio, as well as a high thermal conductivity, the EC360® EMERALD series is the ideal thermal paste for gaming PCs and sophisticated industrial cooling systems.

Nanometer-sized Aluminium oxide compounds, one of the most thermal conductive materials in the world, enable ultimate stability and a high thermal conductivity of 9W/mK. Its good consistency makes it easy to spread and install. Ideal for use with high-performance CPUs and GPUs.

It is long-lasting: low bleed, non-flowing and low evaporation mean it will stay in place and not dry out over time. At the same time, it is not electrically conductive, which allows a safe application.

Types and Configuration

Type	Available sizes
Tube	4 g, 20 g

Material Composition

Type	Percentage
Aluminium Oxide	70%
Carbon	15%
Silicone	15%

Technical Properties

Properties	Unit	Value	Test method
Color	-	grey	visual
Thermal Conductivity	W/mk	9.0	ROCT 8.140-82
Thermal Impedance	°C-in/W	0.14	ROCT 8.140-82
Specific Gravity	g / cm3	1.8	ASTM D 1475
Evaporation (200°C/24h)	%	0.001	FED STD 791
Dissipation Factor	100 Hz	0.005	ASTM D 150
Viscosity	cP	68	GB T-10247
Dielectric Constant	100 Hz	4.0	ASTM D 150
Usable Temperatures	°C	-55 - 220	EN 344

Datasheets