Description

Designed as an all-round thermal paste with the best possible price-performance ratio, as well as a high thermal conductivity, the EC360® EMERALD series is the ideal thermal paste for gaming PCs and sophisticated industrial cooling systems.

Nanometer-sized Aluminium oxide compounds, one of the most thermal conductive materials in the world, enable ultimate stability and a high thermal conductivity of 9W/mK. Its good consistency makes it easy to spread and install. Ideal for use with high-performance CPUs and GPUs.

It is long-lasting: low bleed, non-flowing and low evaporation mean it will stay in place and not dry out over time. At the same time, it is not electrically conductive, which allows a safe application.

Specs

Types and Configuration

TypeAvailable sizes
Tube4 g, 20 g

Material Composition

TypePercentage
Aluminium Oxide70%
Carbon15%
Silicone15%

Technical Properties

PropertiesUnitValueTest method
Color-greyvisual
Thermal ConductivityW/mk9.0ROCT 8.140-82
Thermal Impedance°C-in/W0.14ROCT 8.140-82
Specific Gravityg / cm31.8ASTM D 1475
Evaporation (200°C/24h)%0.001FED STD 791
Dissipation Factor100 Hz0.005ASTM D 150
ViscositycP68GB T-10247
Dielectric Constant100 Hz4.0ASTM D 150
Usable Temperatures°C-55 - 220EN 344

Gallery

Downloads

Datasheets