A mixture of organic silicone grease and filler give the EC360® GLUE series a high thermal conductivity combined with excellent adhesion qualities.

This combination makes it the perfect liquid glue for many applications. The primary use case is attaching heatsinks to RAM, Northbridge and other electrical components.

Its comparatively strong adhesion properties also make it a candidate for attaching heavier heatsinks permanently. When hardened the glue has a silicone like structure which allows a good durability also on flexible surfaces and makes it electrically insulating.

Types and Configuration

Type	Available sizes
Tube	10g, 30g

Material Composition

Type	Percentage
Thermal Conductive Materials	40%
Silicone	35%
Fillers	25%

Technical Properties

Properties	Unit	Value	Test method
Color	-	white	visual
Thermal Conductivity	W/mk	2.0	ASTM D 5470
Thermal Resistance	°C-in2/W	0.246	ASTM D 5470
Evaporation (150°/24h)	%	0.001	-
Bond Strength	MPA	1.8	-
Surface Drying Time (25°)	minutes	6.0	-
Dielectric Constant	1Mhz	5.0	ASTM D 150
Usable Temperatures	°C	-60 - 250	EN344

Datasheets