The EC360® GREEN series presents the low-cost variant of our all-round silicone-based thermal pads. The thermal pads feature a balanced thermal conductivity of 2.5 W/mK and are suitable for a variety of applications.
Possible applications include RAM chips, integrated circuits and other electrical components. The pads have a rubber like consistency, which means that they will deform under pressure and spring back into their original shape. The slight adhesion of the pads allows for easy positioning.
It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.
Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming pads to the perfect size for any surface.
Types and Configurations
|0.5 mm / 0.02 inches||50x50 mm, 100x100 mm, 200x200 mm|
|1.0 mm / 0.04 inches||50x50 mm, 100x100 mm, 200x200 mm|
|1.5 mm / 0.06 inches||50x50 mm, 100x100 mm, 200x200 mm|
|2.0 mm / 0.08 inches||50x50 mm, 100x100 mm, 200x200 mm|
|3.0 mm / 0.12 inches||50x50 mm, 100x100 mm, 200x200 mm|
|4.0 mm / 0.16 inches||50x50 mm, 100x100 mm, 200x200 mm|
|5.0 mm / 0.20 inches||50x50 mm, 100x100 mm, 200x200 mm|
|Thermal Conductivity||W/mk||2.5||ASTM D 5470|
|Specific Gravity||g / cm^3||2.0||ASTM D 792|
|Hardness||Shore OO||40||ASTM D 2240|
|Tensile Strength||psi||6.8||ASTM D 412|
|Elongation||%||12||ASTM D 412|
|Volume Impedance||Ohm-cm||1.0 x 10¹¹||ASTM D 257|
|Breakdown Voltage||kV/mm||6.0||ASTM D 149|
|Dielectric Constant||1Mhz||5.0||ASTM D 150|
|Usable Temperatures||°C||-60 - 200||EN 244|
|Flame Rating||-||VO||UL 94|