The EC360® PLATINUM series presents the high-end variant of high-performance thermal pads. The pads have best thermal conductivity of 16.6 W/mK, more than high-end thermal pastes and are suitable for a variety of applications including CPUs and GPUs (that are cooled by thermal pads), memory chips and other electrical components.
They perform particularly well for water cooling systems, as the pads have a putty like consistency, which means that they will deform and adapt permanently to the surface they are applied to and will not spring back into their original shape.
The slight adhesion of the pads allows for easy positioning. It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.
Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming to the perfect size for any surface.
Types and Configurations
|0.5 mm / 0.02 inches||50x50 mm, 100x100 mm, 200x200 mm|
|1.0 mm / 0.04 inches||50x50 mm, 100x100 mm, 200x200 mm|
|1.5 mm / 0.06 inches||50x50 mm, 100x100 mm, 200x200 mm|
|Thermal Conductivity||W/mk||16.6||ASTM D 5470|
|Specific Gravity||g / cm^3||3.6||ASTM D 792|
|Hardness||Shore OO||65||ASTM D 2240|
|Elongation||%||20||ASTM D 412|
|Volume Impedance||Ohm-cm||5.0 x 10¹⁴||ASTM D 257|
|Breakdown Voltage||kV/mm||5.0||ASTM D 149|
|Usable Temperatures||°C||-50 - 150||EN 344|
|Flame Rating||-||VO||UL 94|