The EC360® PLATINUM series presents the high-end variant of high-performance thermal pads. The pads have best thermal conductivity of 16.6 W/mK, more than high-end thermal pastes and are suitable for a variety of applications including CPUs and GPUs (that are cooled by thermal pads), memory chips and other electrical components.

They perform particularly well for water cooling systems and are easy to use. The pads are not adhesive, but stick a little, so they can be easily positioned. It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.

Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming to the perfect size for any surface.

Types and Configurations

Thickness	Available sizes
0.5 mm / 0.02 inches	50x50 mm, 100x100 mm, 200x200 mm
1.0 mm / 0.04 inches	50x50 mm, 100x100 mm, 200x200 mm
1.5 mm / 0.06 inches	50x50 mm, 100x100 mm, 200x200 mm
2.0 mm / 0.08 inches	50x50 mm, 100x100 mm, 200x200 mm
2.5 mm / 0.10 inches	50x50 mm, 100x100 mm, 200x200 mm
3.0 mm / 0.12 inches	50x50 mm, 100x100 mm, 200x200 mm

Technical Properties

Properties	Unit	Value	Test method
Color	-	grey	visual
Thermal Conductivity	W/mk	16.6	ASTM D 5470
Specific Gravity	g / cm^3	3.5	ASTM D 792
Hardness	Shore C	40	ASTM D 2240
Elongation	kg/cm² Pa	55 5.8*10⁹	ASTM D 412 ASTM D 412
Volume Impedance	Ohm-cm	2.8*10¹¹	ASTM D 257
Breakdown Voltage	kV/mm	5.0	ASTM D 149
Usable Temperatures	°C	-40 - 220	EN 344
Flame Rating	-	VO	UL 94

EC360® PLATINUM 50x50MM

EC360® PLATINUM 100x100MM

Datasheets