Extreme Cool 360 Silver Thermal Pad

Description

The EC360® SILVER series presents the intermediate variant of high-performance thermal pads, which are on eye-level with premium thermal pastes. The pads have a very high thermal conductivity of 12 W/mK and are suitable for a variety of applications including CPUs and GPUs (that are cooled by thermal pads), memory chips and other electrical components.

They perform particularly well for water cooling systems, as the pads have a putty like consistency, which means that they will deform and adapt permanently to the surface they are applied to and will not spring back into their original shape. The slight adhesion of the pads allows for easy positioning.

It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.

Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming to the perfect size for any surface.

Specs

Types and Configurations

ThicknessAvailable sizes
0.5 mm / 0.02 inches50x50 mm, 100x100 mm, 200x200 mm
1.0 mm / 0.04 inches50x50 mm, 100x100 mm, 200x200 mm
1.5 mm / 0.06 inches50x50 mm, 100x100 mm, 200x200 mm

Technical Properties

PropertiesUnitValueTest method
Color-greyvisual
Thermal ConductivityW/mk12ASTM D 5470
Specific Gravityg / cm^32.0ASTM D 792
HardnessShore C20ASTM D 2240
Tensile Strengthpsi782ASTM D 412
Volume ImpedanceOhm-cm2.9 x 10¹¹ASTM D 257
Breakdown VoltagekV/mm6ASTM D 149
Usable Temperatures°C-40 - 220EN 244
Flame Rating-VOUL 94

Gallery

EC360® SILVER 50x50MM

EC360® SILVER 100x100MM

Downloads

Datasheets