The EC360® SILVER series presents the mid-range variant of high-performance thermal pads, which are on eye-level with premium thermal pastes. The pads have a very high thermal conductivity of 12 W/mK and are suitable for a variety of applications including CPUs and GPUs (that are cooled by thermal pads), memory chips and other electrical components.

They perform particularly well for water cooling systems, as the pads have a putty like consistency, which means that they will deform and adapt permanently to the surface they are applied to and will not spring back into their original shape. The slight adhesion of the pads allows for easy positioning.

It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.

Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming to the perfect size for any surface.

Types and Configurations

Thickness	Available sizes
0.5 mm / 0.02 inches	50x50 mm, 100x100 mm, 200x200 mm
1.0 mm / 0.04 inches	50x50 mm, 100x100 mm, 200x200 mm
1.5 mm / 0.06 inches	50x50 mm, 100x100 mm, 200x200 mm
2.0 mm / 0.08 inches	50x50 mm, 100x100 mm, 200x200 mm
2.5 mm / 0.10 inches	50x50 mm, 100x100 mm, 200x200 mm
3.0 mm / 0.12 inches	50x50 mm, 100x100 mm, 200x200 mm

Technical Properties

Properties	Unit	Value	Test method
Color	-	grey	visual
Thermal Conductivity	W/mk	12	ASTM D 5470
Specific Gravity	g / cm^3	2.0	ASTM D 792
Hardness	Shore C	20	ASTM D 2240
Tensile Strength	psi	782	ASTM D 412
Volume Impedance	Ohm-cm	2.9 x 10¹¹	ASTM D 257
Breakdown Voltage	kV/mm	6	ASTM D 149
Usable Temperatures	°C	-40 - 220	EN 244
Flame Rating	-	VO	UL 94

EC360® SILVER 50x50MM

EC360® SILVER 100x100MM

Datasheets